JPS63285997A - 多層基板の製造方法および装置 - Google Patents
多層基板の製造方法および装置Info
- Publication number
- JPS63285997A JPS63285997A JP62120751A JP12075187A JPS63285997A JP S63285997 A JPS63285997 A JP S63285997A JP 62120751 A JP62120751 A JP 62120751A JP 12075187 A JP12075187 A JP 12075187A JP S63285997 A JPS63285997 A JP S63285997A
- Authority
- JP
- Japan
- Prior art keywords
- sides
- prepreg
- resin
- manufacturing
- core material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 18
- 239000011347 resin Substances 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011162 core material Substances 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000012783 reinforcing fiber Substances 0.000 claims abstract description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 9
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 239000002131 composite material Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 238000003825 pressing Methods 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62120751A JPS63285997A (ja) | 1987-05-18 | 1987-05-18 | 多層基板の製造方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62120751A JPS63285997A (ja) | 1987-05-18 | 1987-05-18 | 多層基板の製造方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63285997A true JPS63285997A (ja) | 1988-11-22 |
| JPH0565076B2 JPH0565076B2 (en]) | 1993-09-16 |
Family
ID=14794085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62120751A Granted JPS63285997A (ja) | 1987-05-18 | 1987-05-18 | 多層基板の製造方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63285997A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5310966A (en) * | 1992-02-17 | 1994-05-10 | Kabushiki Kaisha Toshiba | Wiring boards and manufacturing methods thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001138437A (ja) * | 1999-11-17 | 2001-05-22 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
| JP2001334543A (ja) * | 2000-05-26 | 2001-12-04 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236761A (en) * | 1975-09-18 | 1977-03-22 | Koito Mfg Co Ltd | Method of producing printed circuit board conductor circuit |
| JPS5789920A (en) * | 1980-07-24 | 1982-06-04 | Held Kurt | Machine with duplex belt press |
| JPS5850797A (ja) * | 1981-09-21 | 1983-03-25 | 株式会社井上ジャパックス研究所 | プリント配線板の製造方法 |
| JPS5989494A (ja) * | 1982-11-15 | 1984-05-23 | 松下電工株式会社 | プリント配線板用多層銅張積層板の製造法 |
| JPS6186257A (ja) * | 1984-10-05 | 1986-05-01 | 松下電工株式会社 | 積層板の製法 |
| JPS61255858A (ja) * | 1985-05-02 | 1986-11-13 | クルト・ヘルト | 銅張りラミネ−トを製造する方法および装置 |
-
1987
- 1987-05-18 JP JP62120751A patent/JPS63285997A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236761A (en) * | 1975-09-18 | 1977-03-22 | Koito Mfg Co Ltd | Method of producing printed circuit board conductor circuit |
| JPS5789920A (en) * | 1980-07-24 | 1982-06-04 | Held Kurt | Machine with duplex belt press |
| JPS5850797A (ja) * | 1981-09-21 | 1983-03-25 | 株式会社井上ジャパックス研究所 | プリント配線板の製造方法 |
| JPS5989494A (ja) * | 1982-11-15 | 1984-05-23 | 松下電工株式会社 | プリント配線板用多層銅張積層板の製造法 |
| JPS6186257A (ja) * | 1984-10-05 | 1986-05-01 | 松下電工株式会社 | 積層板の製法 |
| JPS61255858A (ja) * | 1985-05-02 | 1986-11-13 | クルト・ヘルト | 銅張りラミネ−トを製造する方法および装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5310966A (en) * | 1992-02-17 | 1994-05-10 | Kabushiki Kaisha Toshiba | Wiring boards and manufacturing methods thereof |
| US5407557A (en) * | 1992-02-17 | 1995-04-18 | Kabushiki Kaisha Toshiba | Wiring boards and manufacturing methods thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0565076B2 (en]) | 1993-09-16 |
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